半導体・バイオ材料研究グループ University Logo

We aim to create new devices by fusing a wide range of technologies such as materials science, surface science, semiconductor devices, nanotechnology, and nanobiotechnology. Our goal is to establish basic technologies that contribute to health and medical applications, such as early diagnosis of diseases and high-throughput screening in drug discovery.

当研究室は,材料工学,表面科学・半導体デバイス・ナノテクノロジー・ナノバイオテクノロジー等の幅広い技術を融合し,新しいデバイスの創生を目指しています. 同時に,疾病の早期診断や創薬におけるハイスループットスクリーニング等,健康・医療応用にも貢献する基盤技術の確立につなげていきます.

artificial cell semiconductore device AHA fluorescent image of artificial cell device model AFM images of bR


Upcoming Presentation

  • The 22nd International Vacuum Congress (IVC-22)
    Sep. 11-16, 2022 
    • "Lateral Diffusion in Supported Lipid Bilayers Affected by Interaction with the Substrate" [Tue-PO1-11]
      Hiroto Yoshimizu, Hibiki Doi, Daiya Mombayashi, Azusa Oshima*, Masumi Yamaguchi*, Akira Heya, Koji Sumitomo
      *NTT Basic Research Labs./BMC
    • "Controlled Fusion of Vesicles Bound to Lipid Bilayers by Biotin/Streptavidin Interactions" [Wed-K1-5]
      Daiya Mombayashi, Azusa Oshima*, Masumi Yamaguchi*, Akira Heya, Koji Sumitomo
      *NTT Basic Research Labs./BMC
  • The 83rd JSAP Autumn Meeting 2022
    Sep. 20-23, 2022 
    • Introduction of Biomolecules into Artificial Lipid Bilayers Using Biotin-Streptavidin Interaction [22p-A106-8]
      Daiya Mombayashi, Azusa Oshima*, Masumi Yamaguchi*, Akira Heya, Koji Sumitomo
      *NTT Basic Research Labs./BMC
    • Analysis of Ca2+ Ion Diffusion Behavior in the Water Layer at the Lipid Bilayer/Substrate Interface [22p-A106-9]
      Hiroto Yoshimizu, Azusa Oshima*, Masumi Yamaguchi*, Akira Heya, Koji Sumitomo
      *NTT Basic Research Labs./BMC
  • 2022 International Conference on Solid State Devices and Materials (SSDM2022)
    Sep. 26-29, 2022 
    • "Effect of Underlayer on Reduction of Graphene Oxide by Atomic Hydrogen Annealing" [B-6-05]
      Akira Heya, Akinori Fujibuchi, Masahiro Hirata, Koji Sumitomo

Contact

Himeji Campus for Engineering, University of Hyogo,
2167 Shosha, Himeji, Hyogo 671-2280, Japan

E-mail: sumitomo@eng.u-hyogo.ac.jp